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- Solution of Warpage Control with Multi-Layer High-Resolution RDL for Glass IC Substrate Application
High-Performance Computing
Solution of Warpage Control with Multi-Layer High-Resolution RDL for Glass IC Substrate Application
- Features
- Min. Line/Via：3μm/5μm
- RDL Stackings：7 Layers
- Warpage：< 0.5mm @G2.5
- TGV Defect Suppression：Adhesion 5B
Description
To meet the future demand for high-performance computing, ITRI has integrated digital lithography and low-temperature sputtering technology to develop a high-resolution and low-warpage for 7-layer re-distribution layers (RDL). It could be applied in high-end panel-level advanced packaging.| Items | 2024 | 2023 |
|---|---|---|
| Line Resolution | 3 μm | 3 μm |
| Via Resolution | 6 μm | 6 μm |
| RDL Layers | 7 Layers | 5 Layers |
| Warpage | < 0.5 mm | < 1 mm |
Dept：Electronic and Optoelectronic System Research Laboratories
POC：吳胤璟
Tel：03-5913685
E-mail：gary.wu@itri.org.tw