Description

To address heat dissipation and uneven chip thickness in multi-chip packaging modules, ITRI has designed a 39GHz AoP package using fan-out embedded thick copper packaging structure. The package integrates power amplifiers (PA), low-noise amplifiers (LNA), and switches into a multi-chip antenna module. Operating at 39GHz, the module exhibits a thermal resistance of 0.679 °C/W, with a junction temperature (Tj) reaching 83.3°C. Antenna characteristics have been measured, covering a frequency range from 38 to 40 GHz. After standard calibration, the antenna achieves a peak gain ranging from 0 to 8 dBi.
 

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Dept：Electronic and Optoelectronic System Research Laboratories
POC：高浩哲
Tel：03-5919298
E-mail：hck@itri.org.tw