Mass Production-Feasible Ultra-Low Thermal Resistance Antenna-in-Packaging (AiP) Module

Features: The Antenna-in-Packaging (AiP) module integrates a large copper ground plane with low-loss materials, achieving high bandwidth and efficient heat dissipation. It’s cost-effective for mass production.

Description

ITRI’s Antenna-in-Packaging (AiP) Module makes it viable for mass production of 60~77GHz. The approach excels in high operating frequencies and wide bandwidth by employing low-polarity resin and encapsulated thermal conductive powders, coupled with asymmetric high-frequency ferrite EMI suppression materials. These innovations are integrated into critical PA and LNA chips, achieving ultra-low thermal resistance of 0.139°C/W and stable junction temperature (Tj) of 76.86°C. Additionally, the technology supports dual-sided PIN configuration to enhance electrical performance.

Dept：Electronic and Optoelectronic System Research Laboratories
POC：高浩哲
Tel：03-5919298
E-mail：hck@itri.org.tw

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