AI Intelligent Wafer Wheel Grinding System

Features: Integrating a high-power spindle with vibration assistance and wheel monitoring, this technology addresses the problem of wheel clogging in the grinding process of silicon carbide wafers.

Description

Integrating a high-power spindle with vibration assistance and wheel monitoring, this technology addresses the problem of wheel clogging in the grinding process of silicon carbide wafers.

Dept：Mechanical and Mechatronics Systems Research Laboratories
POC：翁志強
Tel：03-5918795
E-mail：PeterWeng@itri.org.tw

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