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High-Performance Computing
Heterogeneous Integration Packaging and Multi-Project Wafer Services
- Features
- Provide a service platform for heterogeneous integration packaging from design, manufacturing, to assembly, as well as multi-project wafer process integration technology for small-volume and diverse production.
Description
Provide a heterogeneous integration packaging service from design, manufacturing, to assembly, and a small-volume diverse photomask sharing process integration service platform. This includes technologies such as the RDL process with 2µm fine line width, 5 layers of PI, and 6 layers of metal, as well as low-temperature hybrid bonding processes with 2µm Cu pads.Dept：Electronic and Optoelectronic System Research Laboratories
POC：余成駿
Tel：03-5917868
E-mail：itriA40084@itri.org.tw