Two-Phase Immersion Cooling for AI Server System

Features: Providing total cooling solutions for high-power AI server systems

Description

1. Developing chip-level enhancement components to improve heat transfer efficiency of high-power chips.
2. Implementing low-energy thermal exchange modules to reduce the overall energy consumption of the system's cooling.

Dept：Electronic and Optoelectronic System Research Laboratories
POC：王志耀
Tel：03-5913743
E-mail：cywang@itri.org.tw

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