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High-Performance Computing
Cold Plate Type Liquid Cooling Solution
- Features
- Advanced chip cooling component design offers high-power dissipation and low thermal impedance.
Description
1. Developing chip-level thermal enhancement components to improve heat transfer efficiency of high-power chips.2. Developing new low flow resistance and high-performance heat exchange structures.
Dept：Electronic and Optoelectronic System Research Laboratories
POC：王志耀
Tel：03-5913743
E-mail：cywang@itri.org.tw