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Compound Semiconductors
SiC Laser Slicing technology
- Features
- ITRI has developed advanced laser slicing technology to enhance the cutting speed of ingots and reduce material losses, providing domestic silicon carbide ingot manufacturers with an advanced and efficient wafering solution.
Description
ITRI has developed an advanced laser slicing technology featuring three core innovations: an ultra-short pulse laser compression module (for precise cutting), a line beam optical module (for fast cutting), and high-efficiency ultrasonic fracture techniques. This technology significantly increases the SiC ingot cutting speed, reduces material loss and energy consumption, and uses a dry, eco-friendly process without cutting fluid pollution. It aligns with ESG sustainability goals and offers an advanced, efficient wafering solution.Dept：南分院
POC：陳峻明
Tel：06-6939145
E-mail：chunmin0205@itri.org.tw